A Method for Animating Children’s Drawings of the Human Figure
Harrison Jesse Smith, Qingyuan Zheng, Yifei Li, Somya Jain, Jessica K. Hodgins
IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC + SIPI)
Conformal metal sputtering on package mold compound provides an alternative to meet package and system electromagnetic interference (EMI) and RF interference (RFI) requirements without sacrificing product form factors. However available coating thickness and material options on the industry semiconductor assembly and test (OSTA) market is limited and inadequate. An EM-circuit co-simulation method was developed for conformal shielding effectiveness (SE) analysis for augmented and virtual reality (AR/VR) applications. SE results of various coating thickness and materials are presented to show the custom needs for thicker Cu coating and high permeability coating materials such as Ni.
Harrison Jesse Smith, Qingyuan Zheng, Yifei Li, Somya Jain, Jessica K. Hodgins
Yunbo Zhang, Deepak Gopinath, Yuting Ye, Jessica Hodgins, Greg Turk, Jungdam Won
Simran Arora, Patrick Lewis, Angela Fan, Jacob Kahn, Christopher Ré