IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC + SIPI)
Conformal metal sputtering on package mold compound provides an alternative to meet package and system electromagnetic interference (EMI) and RF interference (RFI) requirements without sacrificing product form factors. However available coating thickness and material options on the industry semiconductor assembly and test (OSTA) market is limited and inadequate. An EM-circuit co-simulation method was developed for conformal shielding effectiveness (SE) analysis for augmented and virtual reality (AR/VR) applications. SE results of various coating thickness and materials are presented to show the custom needs for thicker Cu coating and high permeability coating materials such as Ni.
Donglai Xiang, Timur Bagautdinov, Tuur Stuyck, Fabian Prada, Javier Romero, Weipeng Xu, Shunsuke Saito, Jingfan Guo, Breannan Smith, Takaaki Shiratori, Yaser Sheikh, Jessica Hodgins, Chenglei Wu
Ludwig Sidenmark, Mark Parent, Chi-Hao Wu, Joannes Chan, Michael Glueck, Daniel Wigdor, Tovi Grossman, Marcello Giordano
Xingyi Zhou, Rohit Girdhar, Armand Joulin, Philipp Krähenbühl, Ishan Misra
